<i>III</i>-nitride HEMT Heterostructures with an Ultrathin <i>AlN</i> Barrier: Fabrication and Experimental Application
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<i>III</i>-nitride HEMT Heterostructures with an Ultrathin <i>AlN</i> Barrier: Fabrication and Experimental Application
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PII
S0544126924060066-1
Publication type
Article
Status
Published
Authors
A. S. Gusev 
Affiliation: National Research Nuclear University MEPhI
Pages
539-552
Abstract
Using molecular beam epitaxy (MBE) with plasma-activated nitrogen, III-nitride HEMT heterostructures with an ultrathin AlN barrier were obtained. The effects of nucleation and buffer layer growth conditions on the crystalline quality, surface morphology, and electrophysical properties of the experimental heterostructures were studied. The sheet resistance of the optimized heterostructure was less than 230 Ω/□. Test microwave transistor samples with Schottky gates were fabricated. A parametric model of the HEMT based on the AlN/GaN heterostructure was proposed.
Keywords
молекулярно-лучевая эпитаксия GaN ультратонкий AlN барьер HEMT
Acknowledgment
The study was conducted using the equipment of the Center for Collective Use “Heterostructured microwave electronics and physics of wide-gap semiconductors”, National Research Nuclear University MEPhI, state assignment (project code FSWU-2023-0088)
Received
02.03.2025
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