RAS Nano & ITМикроэлектроника Russian Microelectronics

  • ISSN (Print) 0544-1269
  • ISSN (Online) 3034-5480

SEM Measurements of the Dimensions of Relief Structures in the Technological Process of Manufacturing Microcircuits

PII
10.31857/S0544126923700254-1
DOI
10.31857/S0544126923700254
Publication type
Status
Published
Authors
Volume/ Edition
Volume 52 / Issue number 2
Pages
87-95
Abstract
The problems of measuring the dimensions of relief elements on a scanning electron microscope (SEM) in the technological process of manufacturing microcircuits are considered. The first problem is related to the fact that the increase in the SEM during operation can vary over a wide range depending on the measured dimensions. The second problem is that the probe diameter determined in the SEM calibration process differs from the diameter used in operational measurements. The third problem is related to the fact that it is not known which relief parameter is measured in the SEM probe defocusing method. It is shown that to solve the first problem, it is necessary to calibrate the mark on the image using structures with a trapezoidal profile and large angles of inclination of the side walls. The solution of the second problem is based on the method of defocusing the SEM probe: determining the dependence of the sizes between certain points on the SEM signals on the probe diameter and extrapolating this dependence to the zero value of the diameter. The third problem is solved with the help of a virtual scanning electron microscope.
Keywords
наноэлектроника микро- и нанотехнолигии измерение размеров растровый электронный микроскоп калибровка РЭМ дефокусировка зонда виртуальный растровый электронный микроскоп
Date of publication
16.09.2025
Year of publication
2025
Number of purchasers
0
Views
19

References

  1. 1. Gavrilenko V.P., Novikov Yu.A., Rakov A.V., Todua P.A. // Proc. SPIE. 2009. V. 7405. P. 740504. https://doi.org/10.1117/12.826164
  2. 2. Gavrilenko V.P., Novikov Yu.A., Rakov A.V., Todua P.A., Volk Ch.P. // Proc. SPIE. 2009. V. 7272. P. 72720Z. https://doi.org/10.1117/12.813514
  3. 3. Novikov Yu.A., Darznek S.A., Filippov M.N., Mityukhlyaev V.B., Rakov A.V., Todua P.A. // Proc. SPIE. 2008. V. 7025. P. 702511. https://doi.org/10.1117/12.802428
  4. 4. Novikov Yu.A., Gavrilenko V.P., Ozerin Yu.V., Rakov A.V., Todua P.A. // Proc. SPIE. 2007. V. 6648. P. 66480R. https://doi.org/10.1117/12.733134
  5. 5. Häßler-Grohne W., Bosse H. // Measurement science and technology. 1998. V. 9. P. 1120.
  6. 6. Gavrilenko V.P., Novikov Yu.A., Rakov A.V., Todua P.A. // Proc. SPIE. 2008. V. 7042. P. 70420C. https://doi.org/10.1117/12.794891
  7. 7. SEM Performance Standard. Standard Reference Material 2069a. NBS. 1985.
  8. 8. Oho E., Sasaki T., Kanaya K. // Research Reports of Kogakuin University. 1985. № 59. P. 106 (1985).
  9. 9. Gavrilenko V.P., Kalnov V.A., Novikov Yu.A., Orlikovsky A.A., Rakov A.V., Todua P.A., Valiev K.A., Zhikharev E.N. // Proc. SPIE. 2009. V. 7272. P. 727227. https://doi.org/10.1117/12.814062
  10. 10. Новиков Ю.А. // Микроэлектроника. 2017. Т. 46. № 1. С. 61. https://doi.org/10.7868/S0544126917010070
  11. 11. Новиков Ю.А. // Микроэлектроника. 2014. Т. 43. № 6. С. 456. https://doi.org/10.7868/S0544126914060076
QR
Translate

Индексирование

Scopus

Scopus

Scopus

Crossref

Scopus

Higher Attestation Commission

At the Ministry of Education and Science of the Russian Federation

Scopus

Scientific Electronic Library